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公司：漳州风云电气设备有限公司

E4809-045-109-C

E4809-045-109-C

E4809-045-109-C

E4809-045-109-C

E4809-045-109-C

E4809-045-106-F The current circuit board mainly consists of the following

E4809-045-106-F circuit and Pattern: the circuit is used as a tool for conduction between the components, and a large copper surface will be designed as the grounding and power layer in the design. The line is made at the same time as the drawing.
Dielectric layer: used to keep the insulation between circuits and layers, commonly known as substrate.
E4809-045-106-F hole (Through hole/via): the through hole can make two or more levels of circuits conduct with each other, and the larger through hole can be used as a part plug-in. In addition, the non-through hole (nPTH) is usually used for surface mounting positioning and fixing screws during assembly.
E4809-045-106-F Solder resistant /Solder Mask: Not all copper surfaces have to eat tin-coated parts, so a layer of substance (usually epoxy resin) will be printed on the non-tin-coated areas to avoid short circuit between non-tin-coated lines. According to different processes, it can be divided into green oil, red oil and blue oil.
Legend /Marking/Silk screen: This is an unnecessary structure. Its main function is to mark the names and position boxes of various parts on the circuit board, which is convenient for maintenance and identification after assembly.
Surface Finish: Because the copper surface is easily oxidized in the general environment, it can’t be plated with tin (poor solderability), so it will be protected on the copper surface that needs to eat tin. The protection methods include spraying tin (HASL), melting gold (ENIG), melting silver (Immersion Silver), melting tin (Immersion Tin) and organic flux-retaining (OSP). Each method has its own advantages and disadvantages, which are collectively referred to as surface treatment.